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cy621282bn mobl ? automotive 1-mbit (128 k 8) static ram cypress semiconductor corporation ? 198 champion court ? san jose , ca 95134-1709 ? 408-943-2600 document #: 001-65526 rev. *a revised june 21, 2011 1-mbit (128 k 8) static ram features temperature ranges ? automotive-e: ?40 c to 125 c 4.5 v to 5.5 v operation complementary metal oxide semiconductor (cmos) for optimum speed/power low active power 137.5 mw (max.) (25 ma) low standby power 137.5 ? w (max.) (25 ? a) automatic power-down when deselected ttl-compatible inputs and outputs easy memory expansion with ce 1 , ce 2 , and oe options available in pb-free 32-pin (450 mil-wide) small outline integrated circuit (soic) package functional description the cy621282bn is a high-perf ormance cmos static ram organized as 128k words by 8 bits. easy memory expansion is provided by an active low chip enable (ce 1 ), an active high chip enable (ce 2 ), and active low output enable (oe ). this device has an automatic power-down feature that reduces power consumption by more than 75% when deselected. writing to the device is accomplished by taking chip enable one (ce 1 ) and write enable (we ) inputs low and chip enable two (ce 2 ) input high. data on the eight i/o pins (i/o 0 through i/o 7 ) is then written into the location specified on the address pins (a 0 through a 16 ). reading from the device is accomplished by taking chip enable one (ce 1 ) and output enable (oe ) low while forcing write enable (we ) and chip enable two (ce 2 ) high. under these conditions, the contents of the memory location specified by the address pins will appear on the i/o pins. the eight input/output pins (i/o 0 through i/o 7 ) are placed in a high-impedance state when the device is deselected (ce 1 high or ce 2 low), the outputs are disabled (oe high), or during a write operation (ce 1 low, ce 2 high, and we low). 13 14 a 1 a 2 a 3 a 4 a 5 a 6 a 7 a 8 column decoder row decoder sense amps input buffer power down we oe i/o 0 ce 2 i/o 1 i/o 2 i/o 3 128k x 8 array i/o 7 i/o 6 i/o 5 i/o 4 a 0 a 10 a 12 a 11 a a 9 ce 1 a a 15 a 8 logic block diagram [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 2 of 14 contents product portfolio .............................................................. 3 pin configuration ............................................................. 3 pin definitions .................................................................. 3 maximum ratings ............................................................. 4 operating range ............................................................... 4 electrical characteristics ................................................. 4 capacitance ...................................................................... 5 thermal resistance .......................................................... 5 ac test loads and waveforms ....................................... 5 data retention waveform ................................................ 6 data retention characteristics ....................................... 6 switching characteristics ................................................ 7 switching waveforms ...................................................... 8 truth table ...................................................................... 10 ordering information ...................................................... 10 ordering code definitions ..... .................................... 10 package diagrams .......................................................... 11 acronyms ........................................................................ 12 document conventions ................................................. 12 units of measure ....................................................... 12 document history page ................................................. 13 sales, solutions, and legal information ...................... 14 worldwide sales and design s upport ......... .............. 14 products .................................................................... 14 psoc solutions ......................................................... 14 [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 3 of 14 product portfolio product v cc range (v) speed (ns) power dissipation operating, i cc (ma) standby, i sb2 ( ? a) min typ [1] max typ [1] max typ [1] max cy621282bn automotive-e 4.5 5.0 5.5 70 6 25 2.5 25 pin configuration figure 1. 32-pin soic (top view) 1 2 3 4 5 6 7 8 9 10 11 14 19 20 24 23 22 21 25 28 27 26 top view 12 13 29 32 31 30 16 15 17 18 a 16 a 14 a 12 a 7 a 6 a 5 a 4 a 3 we v cc a 15 a 13 a 8 a 9 i/o 7 i/o 6 i/o 5 i/o 4 a 2 nc i/o 0 i/o 1 i/o 2 ce 1 oe a 10 i/o 3 a 1 a 0 a 11 ce 2 soic gn gnc g g gnd pin definitions i/o type description input a 0 ?a 16 . address inputs input/output i/o 0 ?i/o 7 . data lines. used as input or output lines depending on operation. input/control we . write enable, active low. when selected low, a write is conducted. when selected high, a read is conducted. input/control ce 1 . chip enable 1, active low. input/control ce 2 . chip enable 2, active high. input/control oe . output enable, active low. controls the direction of the i/o pins. when low, the i/o pins behave as outputs. when deasserted high, i/o pins are tri-stated, and act as input data pins. ground gnd . ground for the device. power supply v cc . power supply for the device. note 1. typical values are included for reference only and are not te sted or guaranteed. typical values are measured at v cc = 5.0 v, t a = 25 c. [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 4 of 14 maximum ratings exceeding maximum ratings may impair the useful life of the device. these user guidelines are not tested. storage temperature .. ............... ............... ?65 c to +150 c ambient temperature with power applied ............ ............... ............... ?55 c to +125 c supply voltage on v cc to relative gnd [2] .................................?0.5 v to +7.0 v dc voltage applied to outputs in high z state [2] ................................ ?0.5 v to v cc + 0.5 v dc input voltage [2, 3] .......................... ?0.5 v to v cc + 0.5 v current into outputs (low) ........................................ 20 ma static discharge voltage .......................................... > 2001 v (per mil-std-883, method 3015) latch-up current .................................................... > 200 ma operating range range ambient temperature v cc automotive-e ?40 c to +125 c 5 v ? 10% electrical characteristics over the operating range parameter description test conditions -70 unit min typ [4] max v oh output high voltage v cc = 4.5 v, i oh = ?1.0 ma 2.4 ? ? v v cc = 5.5 v, i oh = ?0.1 ma 3.95 ? ? v cc = 5 v, i oh = ?0.1 ma 3.6 ? ? v cc = 4.5 v, i oh = ?0.1 ma 3.25 ? ? v ol output low voltage v cc = 4.5 v, i ol = 2.1 ma ? ? 0.4 v v ih input high voltage 2.2 ? v cc + 0.3 v v il input low voltage [2] ?0.3 ? 0.8 v i ix input leakage current gnd ? v i ? v cc ?10 ? +10 ? a i oz output leakage current gnd ? v i ? v cc , output disabled ?10 ? +10 ? a i cc v cc operating supply current f = f max = 1/t rc v cc = 5.5 v, i out = 0 ma ?625ma f = 1 mhz 2 12 i sb1 automatic ce power-down current ?ttl inputs v cc = 5.5 v, ce 1 ? v ih or ce 2 < v il , v in ? v ih or v in ? v il , f = f max ?0.12ma i sb2 automatic ce power-down current ?cmos inputs v cc = 5.5 v, ce 1 ? v cc ? 0.3 v, or ce 2 ? 0.3 v, v in ? v cc ? 0.3 v, or v in ? 0.3 v, f = 0 ?2.525 ? a notes 2. v il (min.) = ?2.0 v for pulse durations of less than 20 ns. 3. no input may exceed v cc + 0.5 v. 4. typical values are included for reference only and are not tested or guaranteed. typical values are measured at v cc = 5.0 v, t a = 25 c. [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 5 of 14 capacitance parameter [5] description test conditions max unit c in input capacitance t a = 25 ? c, f = 1 mhz, v cc = 5.0 v 9 pf c out output capacitance 9pf thermal resistance parameter [5] description test conditions 32-pin soic unit ? ja thermal resistance (junction to ambient) test conditions follow standard test methods and procedures for measuring thermal impedance, per eia / jesd51. 66.17 ? c/w ? jc thermal resistance (junction to case) 30.87 ? c/w ac test loads and waveforms figure 2. ac test loads and waveforms 90% 10% v cc gnd 90% 10% all input pulses 5 v output 100 pf including jig and scope 5v output 5 pf including jig and scope (a) (b) output r1 1800 ? ? r1 1800 ? ? r2 990 ? r2 990 ? 639 ? equivalent to: thvenin equivalent 1.77 v rise time: 1 v/ns fall time: 1 v/ns ? 5. tested initially and after any design or process changes that may affect these parameters. [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 6 of 14 data retention waveform figure 3. data retention waveform v cc , min. v cc , min. t cdr v dr > 2 v t r ce 1 v cc ce 2 or data retention mode data retention characteristics over the operating range parameter description conditions min typ max unit v dr v cc for data retention 2.0 ? ? v i ccdr data retention current v cc = v dr = 2.0 v, ce 1 ?? v cc ? 0.3 v, or ce 2 ? 0.3 v, v in ? v cc ? 0.3 v or, v in ? 0.3 v automotive-e ? 1.5 25 ? a t cdr chip deselect to data retention time 0??ns t r operation recovery time 70 ? ? ns [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 7 of 14 switching characteristics over the operating range parameter [6] description cy621282bn-70 unit min max read cycle t rc read cycle time 70 ? ns t aa address to data valid ? 70 ns t oha data hold from address change 5 ? ns t ace ce 1 low to data valid, ce 2 high to data valid ? 70 ns t doe oe low to data valid ? 35 ns t lzoe oe low to low z [7] 0?ns t hzoe oe high to high z [7, 8] ?25ns t lzce ce 1 low to low z, ce 2 high to low z [7] 5?ns t hzce ce 1 high to high z, ce 2 low to high z [7, 8] ?25ns t pu ce 1 low to power-up, ce 2 high to power-up 0 ? ns t pd ce 1 high to power-down, ce 2 low to power-down ? 70 ns write cycle [9] t wc write cycle time 70 ? ns t sce ce 1 low to write end, ce 2 high to write end 60 ? ns t aw address set-up to write end 60 ? ns t ha address hold from write end 0 ? ns t sa address set-up to write start 0 ? ns t pwe we pulse width 50 ? ns t sd data set-up to write end 30 ? ns t hd data hold from write end 0 ? ns t lzwe we high to low z [7] 5?ns t hzwe we low to high z [7, 8] ?25ns notes 6. test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5 v, input pulse levels of 0 to 3 .0 v, and output loading of the specified i ol /i oh and 100-pf load capacitance. 7. at any given temperature and voltage condition, t hzce is less than t lzce , t hzoe is less than t lzoe , and t hzwe is less than t lzwe for any given device. 8. t hzoe , t hzce , and t hzwe are specified with a load capacitance of 5 pf as in (b) of figure 2 on page 5 . transition is measured ? 500 mv from steady-state voltage. 9. the internal write time of the memory is defined by the overlap of ce 1 low, ce 2 high, and we low. ce 1 and we must be low and ce 2 high to initiate a write, and the transition of any of these signals can terminate the writ e. the input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write. [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 8 of 14 switching waveforms figure 4. read cycle no.1 [10, 11] figure 5. read cycle no. 2 (oe controlled) [11, 12] figure 6. write cycle no. 1 (ce 1 or ce 2 controlled) [13, 14] previous data valid data valid t rc t aa t oha address data out 50% 50% data valid t rc t ace t doe t lzoe t lzce t pu high impedance t hzoe t hzce t pd high oe ce 1 i cc i sb impedance address ce 2 data out v cc supply current t wc data valid t aw t sa t pwe t ha t hd t sd t sce t sce ce 1 address ce 2 we data i/o notes 10. device is continuously selected. oe , ce 1 = v il , ce 2 = v ih . 11. we is high for read cycle. 12. address valid prior to or coincident with ce 1 transition low and ce 2 transition high. 13. data i/o is high impedance if oe = v ih . 14. if ce 1 goes high or ce 2 goes low simultaneously with we going high, the output remains in a high-impedance state. [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 9 of 14 figure 7. write cycle no. 2 (we controlled, oe high during write) [15, 16] figure 8. write cycle no. 3 (we controlled, oe low) [15, 16] switching waveforms (continued) t hd t sd t pwe t sa t ha t aw t sce t sce t wc t hzoe data in valid ce 1 address ce 2 we data i/o oe note 17 data valid t hd t sd t lzwe t pwe t sa t ha t aw t sce t sce t wc t hzwe ce 1 address ce 2 we data i/o note 17 notes 15. data i/o is high impedance if oe = v ih . 16. if ce 1 goes high or ce 2 goes low simultaneously with we going high, the output remains in a high-impedance state. 17. during this period the i/os are in the output state and input signals should not be applied. [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 10 of 14 truth table ce 1 ce 2 oe we i/o 0 ?i/o 7 mode power h x x x high z power-down standby (i sb ) x l x x high z power-down standby (i sb ) lhlhdata out read active (i cc ) l h x l data in write active (i cc ) l h h h high z selected, outputs disabled active (i cc ) ordering information speed (ns) ordering code package diagram package type operating range 70 cy621282bnll-70sxe 51-85081 32-pin 450-mil soic (pb-free) automotive-e please contact your local cypress sales r epresentative for availability of these parts. ordering code definitions temperature grade: e = automotive-e pb-free package type: s = 32-pin soic speed grade: 70 ns ll = low power nitride seal mask fix b = process technology 250 nm fixed value bus width = 8 density = 1-mbit family code: mobl sram family company id: cy = cypress cy 70 s 621 2 8 n x ll e - b 2 [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 11 of 14 package diagrams figure 9. 32-pin molded soic (450 mil) s32.45/ sz32.45, 51-85081 51-85081 *c [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 12 of 14 acronyms document conventions units of measure acronym description ce chip enable cmos complementary metal oxide semiconductor i/o input/output oe output enable soic small outline integrated circuit sram static random access memory ttl transistor-transistor logic we write enable symbol unit of measure c degree celsius mhz mega hertz a micro amperes ? s micro seconds ma milli amperes mv milli volts mw milli watts ns nano seconds ? ohms % percent pf pico farad vvolts wwatts [+] feedback [+] feedback
cy621282bn mobl ? automotive document #: 001-65526 rev. *a page 13 of 14 document history page document title: cy621282bn mobl ? automotive, 1-mbit (1 28 k 8) static ram document number: 001-65526 rev. ecn no. issue date orig. of change description of change ** 3115909 01/06/2011 rame new data sheet *a 3288690 06/21/2011 rame removed the note ?for best-prac tice recommendations, please refer to the cypress application note ?system design guidelines? on http://www.cypress.com.? and its reference in functional description . updated in new template. [+] feedback [+] feedback
document #: 001-65526 rev. *a revised june 21, 2011 page 14 of 14 all products and company names mentioned in this document may be the trademarks of their respective holders. cy621282bn mobl ? automotive ? cypress semiconductor corporation, 2011. the information contained herein is subject to change without notice. cypress semico nductor corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a cypress product. nor does it convey or imply any license under patent or other rig hts. cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with cypres s. furthermore, cypress does not authorize its products for use as critical components in life-support systems where a ma lfunction or failure may reasonably be expe cted to result in significant injury to the user. the inclusion of cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies cypress against all charges. any source code (software and/or firmware) is owned by cypress semiconductor corporation (cypress) and is protected by and subj ect to worldwide patent protection (united states and foreign), united states copyright laws and internatio nal treaty provisions. cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the cypress source code and derivative works for the sole purpose of creating custom software and or firmware in su pport of licensee product to be used only in conjunction with a cypress integrated circuit as specified in the applicable agreement. any reproduction, modification, translation, compilation, or repre sentation of this source code except as specified above is prohibited without the express written permission of cypress. disclaimer: cypress makes no warranty of any kind, express or implied, with regard to this material, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. cypress reserves the right to make changes without further notice to t he materials described herein. cypress does not assume any liability arising out of the application or use of any product or circuit described herein. cypress does not authori ze its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. the inclusion of cypress? prod uct in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies cypress against all charges. use may be limited by and subject to the applicable cypress software license agreement. sales, solutions, and legal information worldwide sales and design support cypress maintains a worldwide network of offices, solution center s, manufacturer?s representatives, and distributors. to find t he office closest to you, visit us at cypress locations . products automotive cypress.co m/go/automotive clocks & buffers cypress.com/go/clocks interface cypress. com/go/interface lighting & power control cypress.com/go/powerpsoc cypress.com/go/plc memory cypress.com/go/memory optical & image sensing cypress.com/go/image psoc cypress.com/go/psoc touch sensing cyp ress.com/go/touch usb controllers cypress.com/go/usb wireless/rf cypress.com/go/wireless psoc solutions psoc.cypress.com/solutions psoc 1 | psoc 3 | psoc 5 [+] feedback [+] feedback

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